Circuit device and oscillator

ABSTRACT

A circuit device includes an oscillation circuit generating an oscillation signal by oscillating a vibrator, a temperature sensor circuit performing an intermittent operation, a logic circuit performing temperature compensation processing based on an output of the temperature sensor circuit, and a power supply circuit supplying power to the oscillation circuit. The oscillation circuit is disposed in a circuit region, the temperature sensor circuit and the logic circuit are disposed in a circuit region, and the power supply circuit is disposed in a circuit region, which is positioned between the circuit region and the circuit region.

The present application is based on, and claims priority from JPApplication Serial Number 2020-160718, filed Sep. 25, 2020, thedisclosure of which is hereby incorporated by reference herein in itsentirety.

BACKGROUND 1. Technical Field

The present disclosure relates to a circuit device, an oscillator, andthe like.

2. Related Art

In the related art, a circuit device having an oscillation circuit thatoscillates a vibrator such as a quartz crystal vibrator is known.JP-A-2015-90973 discloses a layout disposition of a circuit devicehaving a temperature compensated oscillation circuit. InJP-A-2015-90973, a circuit block having an analog circuit as a componentand a circuit block having a digital circuit as a component are disposedseparately, and the wiring that electrically couples the analog circuitand the vibrator is laid out so that the wiring does not overlap withthe block of the digital circuit.

A temperature sensor circuit is used for temperature compensationprocessing of an oscillation frequency of an oscillation circuit. Atarget of the temperature compensation processing is the oscillationfrequency of a vibrator. Therefore, in order to measure the temperatureof the vibrator more accurately, the temperature sensor circuit isusually disposed near the oscillation circuit to which the vibrator iselectrically coupled. This is because the heat of the vibrator istransferred from the vibrator to the oscillation circuit via a metalterminal or a wiring.

On the other hand, in a circuit device having a temperature compensatedoscillation circuit, it is conceivable to operate the temperature sensorcircuit intermittently in order to achieve low power consumption.However, when the temperature sensor circuit performs the intermittentoperation in this way, the current consumption of the temperature sensorcircuit changes in an AC manner. Therefore, it has been found that whensuch a temperature sensor circuit is close to the oscillation circuit,the temperature sensor circuit may become a noise source and the signalcharacteristics of the oscillation signal of the oscillation circuit maydeteriorate.

SUMMARY

An aspect of the present disclosure relates to a circuit deviceincluding: an oscillation circuit generating an oscillation signal byoscillating a vibrator; a temperature sensor circuit performing anintermittent operation; a logic circuit performing temperaturecompensation processing based on an output of the temperature sensorcircuit; and a power supply circuit supplying power to the oscillationcircuit, in which the oscillation circuit is disposed in a first circuitregion, the temperature sensor circuit and the logic circuit aredisposed in a second circuit region, and the power supply circuit isdisposed in a third circuit region positioned between the first circuitregion and the second circuit region.

Another aspect of the present disclosure relates to a circuit deviceincluding: an oscillation circuit generating an oscillation signal byoscillating a vibrator; a temperature sensor circuit performing anintermittent operation; a logic circuit performing temperaturecompensation processing based on an output of the temperature sensorcircuit; a power supply terminal to which a power supply voltage isinput; and a ground terminal to which a ground voltage is input, inwhich the oscillation circuit is disposed in a first circuit region, thetemperature sensor circuit and the logic circuit are disposed in asecond circuit region, and the power supply terminal and the groundterminal are diagonally disposed in the second circuit region.

Further, still another aspect of the present disclosure relates to anoscillator including the circuit device described above and thevibrator.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates an example of a configuration of a circuit device ofthe present embodiment.

FIG. 2 illustrates an example of a layout disposition of the circuitdevice of the present embodiment.

FIG. 3 illustrates an example of a configuration of an oscillationcircuit.

FIG. 4 illustrates an example of a configuration of a temperature sensorcircuit.

FIG. 5 is an explanatory view of an operation of the temperature sensorcircuit.

FIG. 6 illustrates an example of characteristics of frequency deviationof a clock signal and an output pulse signal with respect totemperature.

FIG. 7 illustrates a detailed example of a configuration of a countercircuit.

FIG. 8 is a detailed explanatory view of an operation of the temperaturesensor circuit.

FIG. 9 is an explanatory view of deterioration of signal characteristicsof an oscillation signal generated due to an intermittent operation.

FIG. 10 illustrates an example of a configuration of a ring oscillator.

FIG. 11 illustrates an example of a configuration of a regulator.

FIG. 12 illustrates an example of a configuration of a current settingcircuit.

FIG. 13 illustrates an example of wirings of a power supply line and aground line in the circuit device.

FIG. 14 illustrates another example of a layout disposition of thecircuit device of the present embodiment.

FIG. 15 illustrates still another example of a layout disposition of thecircuit device of the present embodiment.

FIG. 16 illustrates a structural example of the oscillator.

DESCRIPTION OF EXEMPLARY EMBODIMENTS

Hereinafter, the present embodiment will be described. The presentembodiment to be described below does not unduly limit the contents ofthe disclosure described in the appended claims. Further, allconfigurations to be described in the present embodiment are not limitedto being essential constituent conditions.

1. Circuit Device

FIG. 1 illustrates an example of a configuration of a circuit device 20according to the present embodiment. The circuit device 20 of thepresent embodiment includes at least an oscillation circuit 30, atemperature sensor circuit 40, and a logic circuit 50. The circuitdevice 20 can include a power supply circuit 60. Further, the oscillator4 of the present embodiment includes a vibrator and the circuit device20. The vibrator 10 is electrically coupled to the circuit device 20.For example, the vibrator 10 and the circuit device 20 are electricallycoupled using an internal wiring, a bonding wire, a metal bump, or thelike of a package that accommodates the vibrator 10 and the circuitdevice 20.

The vibrator 10 is an element generating mechanical vibration by anelectric signal. The vibrator 10 can be realized by a vibrator elementsuch as a quartz crystal vibrator element, for example. For example, thevibrator 10 can be realized by a tuning fork type quartz crystalvibrator element, a twin tuning fork type quartz crystal vibratorelement, or a quartz crystal vibrator element whose cut angle vibratesin a thickness-slide manner such as an AT cut or an SC cut. For example,the vibrator 10 may be a vibrator built in a temperature compensatedcrystal oscillator (TCXO) having no constant temperature oven, or avibrator built in a constant temperature oven controlled crystaloscillator (OCXO) having a constant temperature oven. Note that, thevibrator 10 according to the present embodiment can be realized byvarious vibrator elements such as vibrator elements other than a tuningfork type, twin tuning fork type, or a thickness-slide vibration type,or piezoelectric vibrator elements made of materials other than quartzcrystal. For example, as the vibrator 10, a surface acoustic wave (SAW)resonator, a micro electro mechanical systems (MEMS) vibrator as asilicon vibrator formed using a silicon substrate, or the like may beadopted.

The circuit device 20 is an integrated circuit device called anintegrated circuit (IC). For example, the circuit device 20 is an ICmanufactured by a semiconductor process and is a semiconductor chip inwhich circuit elements are formed on a semiconductor substrate. In FIG.1 , the circuit device 20 includes the oscillation circuit 30, thetemperature sensor circuit 40, the logic circuit 50, the power supplycircuit 60, an output buffer circuit 70, and an I/O circuit 80.

The oscillation circuit 30 is a circuit that oscillates the vibrator 10.For example, the oscillation circuit 30 is electrically coupled to theterminals TX1 and TX2 and generates an oscillation signal OSC by causingthe vibrator 10 to oscillate. As an example, the oscillation circuit 30generates an oscillation signal OSC having a frequency of, for example,32 KHz. The terminal TX1 is a first terminal, and the terminal TX2 is asecond terminal. For example, the oscillation circuit 30 can be realizedby a drive circuit for oscillation provided between the terminal TX1 andthe terminal TX2 and an active element such as a capacitor or aresistor. The drive circuit can be realized by, for example, a CMOSinverter circuit or a bipolar transistor. The drive circuit is a corecircuit of the oscillation circuit 30, and the drive circuit oscillatesthe vibrator 10 by voltage driving or current driving the vibrator 10.As the oscillation circuit 30, various types of oscillation circuits canbe used such as an inverter type, a Pierce type, a Colpitts type, or aHartley type. Further, the oscillation circuit 30 is provided with avariable capacitance circuit and can adjust the oscillation frequency byadjusting the capacitance of the variable capacitance circuit. Thevariable capacitance circuit can be realized by, for example, acapacitor array and a switch array coupled to the capacitor array. Forexample, the variable capacitance circuit includes a first capacitorarray having a plurality of capacitors whose capacitance values arebinary weighted. Further, the variable capacitance circuit includes afirst switch array having a plurality of switches in which each switchturns on and off the coupling between each capacitor in the firstcapacitor array and terminal TX1. Further, as the variable capacitancecircuit, a first variable capacitance circuit, which has the firstcapacitor array and the first switch array and is coupled to terminalTX1, and a second variable capacitance circuit, which has the secondcapacitor array and the second switch array and is coupled to theterminal TX2, may be provided. Note that, it is also possible to realizethe variable capacitance circuit by a variable capacitance element suchas a varactor. Further, coupling in the present embodiment is electricalcoupling. The electrical coupling is coupling that an electrical signalis transmittable, and coupling that enables transmission of informationby an electrical signal. The electrical coupling may be coupling via anactive element or the like.

The temperature sensor circuit 40 measures the temperature such as theenvironmental temperature of the vibrator 10 or the circuit device 20,and outputs the result as temperature data TSQ. The temperature data TSQis data, for example, that monotonously increases or monotonouslydecreases with respect to the temperature in an operation temperaturerange of the circuit device 20. The temperature sensor circuit 40 is atemperature sensor that utilizes the fact that the oscillation frequencyof the ring oscillator 42 has a temperature dependency, as illustratedin FIG. 4 described later. Specifically, as illustrated in FIG. 4 , thetemperature sensor circuit 40 includes a ring oscillator 42 and acounter circuit 44. In a count period TSENS defined by a clock signal CKbased on the oscillation signal OSC from the oscillation circuit 30, thecounter circuit 44 counts an output pulse signal RCK, which is anoscillation signal of the ring oscillator 42 and outputs the count valueas the temperature data TSQ. Note that, the temperature sensor circuit40 is not limited to this, for example, an analog temperature sensor,which outputs a temperature detection voltage by utilizing the fact thata forward voltage of the PN junction has a temperature dependency, andan A/D conversion circuit, which A/D converts the temperature detectionvoltage and outputs the temperature data TSQ, may be included.

In the present embodiment, the temperature sensor circuit 40 performs anintermittent operation. For example, the temperature sensor circuit 40performs the intermittent operation of obtaining the temperature dataTSQ corresponding to the temperature during the operation period andstopping the operation of the temperature sensor circuit 40 afteroutputting the obtained temperature data TSQ to the logic circuit 50.The details of the intermittent operation will be described later.

The logic circuit 50 performs temperature compensation processing basedon the output of the temperature sensor circuit 40. This temperaturecompensation processing is performed by the temperature compensationcircuit 54 of the logic circuit 50. The temperature compensationprocessing is, for example, processing of compensating by reducingfluctuations in the oscillation frequency caused by the temperaturefluctuations. That is, the logic circuit 50 performs the temperaturecompensation processing for the oscillation frequency of the oscillationcircuit 30 so that the frequency becomes constant even when thetemperature fluctuates. Specifically, the logic circuit 50 performs thedigital temperature compensation processing based on the temperaturedata TSQ that is the output of the temperature sensor circuit 40. Forexample, the logic circuit 50 obtains frequency adjustment data based onthe temperature data TSQ. Further, by adjusting the capacitance value ofthe variable capacitance circuit of the oscillation circuit 30 describedabove based on the obtained frequency adjustment data, the temperaturecompensation processing for the oscillation frequency of the oscillationcircuit 30 is realized. For example, the logic circuit 50 has a storagecircuit, and the storage circuit stores a lookup table that representsthe correspondence between the temperature data TSQ and the frequencyadjustment data. The logic circuit performs the temperature compensationprocessing for obtaining frequency adjustment data from the temperaturedata TSQ by using the lookup table. The storage circuit can be realizedby, for example, a non-volatile memory. The non-volatile memory is, forexample, an EEPROM such as a FAMOS memory or a MONOS memory, but is notlimited to this, and may be an OTP memory, a fuse type ROM, or the like.Alternatively, the storage circuit may be realized by a RAM or may berealized by a register configured with a latch circuit or the like. Notethat, the logic circuit 50 may perform arithmetic processing forconverting the temperature data TSQ into converted temperature data, andthe lookup table may be a table that represents the correspondencebetween the converted temperature data and the frequency adjustmentdata. The converted temperature data is data that monotonously increasesor monotonously decreases with respect to the temperature similar to thetemperature data TSQ, but the slope of the converted temperature data isconverted from the slope of the temperature data TSQ corresponding tothe temperature range.

The logic circuit 50 is a control circuit and performs various controlprocesses. For example, the logic circuit 50 controls the entire circuitdevice 20 and controls the operation sequence of the circuit device 20.Further, the logic circuit 50 may perform various processing forcontrolling the oscillation circuit 30 or may control the temperaturesensor circuit 40 or the power supply circuit 60. The logic circuit 50can be realized, for example, by an application specific integratedcircuit (ASIC) configured with automatic placement and wiring such as agate array.

The power supply voltage VDD from the power supply terminal TVDD issupplied to the power supply circuit 60, and the power supply circuit 60supplies various power supply voltages for the internal circuit of thecircuit device 20 to the internal circuit. The power supply circuit 60can also be called a reference signal generation circuit that generatesa reference signal such as a reference voltage or a reference currentused in the circuit device 20. For example, the power supply circuit 60supplies power to at least the oscillation circuit 30. Further, thepower supply circuit 60 may supply power to the logic circuit 50.Specifically, in FIG. 1 , the power supply circuit 60 has a regulator61, and the regulator 61 supplies a regulated power supply voltage VREG1to the oscillation circuit 30 as a power source by regulating the powersupply voltage VDD, which is an external power supply voltage. Further,the power supply circuit 60 has a regulator 62, and the regulator 62supplies a regulated power supply voltage VREG2 to the logic circuit 50as a power source by regulating the power supply voltage VDD. The VDDis, for example, a voltage of 1.5 to 3.6 V. Further, the VREG1 has avoltage of, for example, 0.9 to 1.1 V, and the VREG2 has a voltage of,for example, 1.1 to 1.3 V. Further, the VREG3 described later is, forexample, a voltage of 1.25 to 1.45 V.

The output buffer circuit 70 outputs an output clock signal CKQ based onthe oscillation signal OSC. For example, the output buffer circuit 70buffers the clock signal CK based on the oscillation signal OSC andoutputs the clock signal CK as the output clock signal CKQ to the clockterminal TCK. Thereafter, the output clock signal CKQ is output to theoutside via the external terminal TECK of the oscillator 4. For example,the output buffer circuit 70 outputs the output clock signal CKQ in asingle-ended CMOS signal format. For example, the logic circuit 50outputs the clock signal CK based on the oscillation signal OSC that isan oscillation clock signal from the oscillation circuit 30. Forexample, the logic circuit 50 receives an output enable signal OE froman output enable terminal TOE via the I/O circuit 80. Thereafter, thelogic circuit 50 outputs the oscillation signal OSC as the clock signalCK when the output enable signal OE is active. Thereafter, the outputbuffer circuit 70 buffers the clock signal CK and outputs the clocksignal CK as the output clock signal CKQ. On the other hand, the logiccircuit 50 sets the clock signal CK to a fixed voltage level such as alow level, for example, when the output enable signal OE is inactive. Asa result, the voltage level of the clock terminal TCK is set to a fixedvoltage level. Note that, a phrase that the signal is active means, forexample, that the signal is a high level in the case of a positive logicand is a low level in the case of a negative logic. Further, a phrasethat the signal is inactive means, for example, that the signal is a lowlevel in the case of a positive logic and is a high level in the case ofa negative logic. Note that, the output buffer circuit 70 may output theoutput clock signal CKQ in a signal format other than CMOS.

The I/O circuit 80 is a circuit that receives the output enable signalOE from the output enable terminal TOE and outputs the output enablesignal OE to the logic circuit 50. The I/O circuit 80 can include, forexample, a test circuit for inspection such as an analog circuit of thecircuit device 20.

The circuit device 20 also includes the power supply terminal TVDD, aground terminal TGND, and a clock terminal TCK. Further, the circuitdevice 20 includes terminals TX1 and TX2 for coupling the vibrator andthe output enable terminal TOE. These terminals are, for example, padsof the circuit device 20 which is a semiconductor chip. For example, inthe pad region, a metal layer is exposed from a passivation film whichis an insulation layer, and the exposed metal layer constitutes a padwhich is a terminal of the circuit device 20.

The power supply terminal TVDD is a terminal to which the power supplyvoltage VDD is supplied. For example, the power supply voltage VDD froman external power supply device is supplied to the power supply terminalTVDD. The ground terminal TGND is a terminal to which a ground voltageGND is supplied. GND can also be referred to VSS, and the ground voltageis, for example, a ground potential. In the present embodiment, a groundis appropriately referred to as GND. The clock terminal TCK is aterminal to which the output clock signal CKQ, which is generated basedon the oscillation signal OSC of the oscillation circuit 30, is output.The output enable terminal TOE is a terminal for controlling the enableand disable of the output of the output clock signal CKQ. The powersupply terminal TVDD, the ground terminal TGND, the clock terminal TCK,and the output enable terminal TOE are electrically coupled to theexternal terminals TEVDD, TEGND, TECK, and TEOE for external coupling ofthe oscillator 4, respectively. For example, the electrical coupling ismade using an internal wiring of a package, a bonding wire, a metalbump, or the like. Further, the external terminals TEVDD, TEGND, TECK,and TEOE of the oscillator 4 are electrically coupled to the externaldevice.

The terminal TX1 which is the first terminal is electrically coupled toone end of the vibrator 10, and the terminal TX2 which is the secondterminal is electrically coupled to the other end of the vibrator 10.For example, the terminals TX1 and TX2 of the circuit device 20 and thevibrator 10 are electrically coupled with each other using internalwiring, a bonding wire, a metal bump, or the like of a package thataccommodates the vibrator 10 and the circuit device 20.

FIG. 2 illustrates an example of a layout disposition of the circuitdevice 20 of the present embodiment. In the example of the layoutdisposition in FIG. 2 , the layout disposition of each circuit of thecircuit device 20 described with reference to FIG. 1 is illustrated.FIG. 2 illustrates an example of the disposition in a plan view seenfrom a direction orthogonal to a substrate on which the circuit elementof the circuit device 20 is formed. Note that, in FIG. 2 , “ESD” is anelectrostatic protection circuit, and “TEST” is a terminal for testingused at the time of inspection of the circuit device 20.

The circuit device 20 has sides SD1, SD2, SD3, and SD4. The sides SD1,SD2, SD3, and SD4 are a first side, a second side, a third side, and afourth side, respectively. The sides SD1, SD2, SD3, and SD4 correspondto the sides of the rectangular semiconductor chip which is the circuitdevice 20. For example, the sides SD1, SD2, SD3, and SD4 are the sidesof a substrate of the semiconductor chip. The semiconductor chips arealso called silicon dies. The side SD2 is an opposite side of the sideSD1. The side SD3 is a side that intersects the sides SD1 and SD2. Theintersection means, for example, orthogonal. The side SD4 is an oppositeside of the side SD3. The side SD4 intersects sides SD1 and SD2. Adirection from the side SD1 toward the side SD2 is referred to as DR1,and a direction opposite to the direction DR1 is referred to as DR2.Further, a direction from the side SD3 toward the side SD4 is referredto as DR3, and a direction opposite to the direction DR3 is referred toas DR4. The directions DR1, DR2, DR3, and DR4 are a first direction, asecond direction, a third direction, and a fourth direction,respectively.

As described with reference to FIG. 1 , the circuit device 20 of thepresent embodiment includes the oscillation circuit 30 that oscillatesthe vibrator 10 to generate the oscillation signal OSC, the temperaturesensor circuit 40 that performs the intermittent operation, a logiccircuit that performs the temperature compensation processing based onthe output of the temperature sensor circuit 40, and the power supplycircuit 60 that supplies power to the oscillation circuit 30. Forexample, the regulated power supply voltage VREG1 is supplied from thepower supply circuit 60 to the oscillation circuit 30 as a power source,and the oscillation circuit 30 generates the oscillation signal OSC byperforming an oscillation operation to oscillate the vibrator 10. Thetemperature sensor circuit 40 detects the temperature while performingthe intermittent operation that repeats an operation period and a stopperiod and outputs the detection result as temperature data TSQ to thelogic circuit 50. The logic circuit 50 performs the temperaturecompensation processing based on the temperature data TSQ which is anoutput of the temperature sensor circuit 40. For example, the logiccircuit 50 performs the temperature compensation processing that keepsthe oscillation frequency of the oscillation circuit 30 constant evenwhen the environmental temperature fluctuates. Specifically, thetemperature compensation processing for the oscillation frequency isrealized by adjusting the capacitance values of the variable capacitancecircuit included in the oscillation circuit 30 based on the capacitancevalue adjustment data, which is the frequency adjustment data obtainedby the temperature data TSQ.

As illustrated in FIG. 2 , in the present embodiment, the oscillationcircuit 30 is disposed in the circuit region RG1. Further, thetemperature sensor circuit 40 and the logic circuit 50 are disposed inthe circuit region RG2. The power supply circuit 60 is disposed in thecircuit region RG3, which is positioned between the circuit region RG1and the circuit region RG2. The circuit regions RG1, RG2, and RG3 are afirst circuit region, a second circuit region, and a third circuitregion, respectively. For example, the circuit region RG1 is a regionalong the side SD1, and the circuit region RG2 is a region along theside SD2 which is an opposite side of the side SD1. The circuit regionRG3 is a region positioned between the circuit region RG1 and thecircuit region RG2. For example, the power supply circuit 60 is disposedin the circuit region RG3 on the direction DR1 side of the circuitregion RG1 where the oscillation circuit 30 is disposed, and thetemperature sensor circuit 40 or the logic circuit 50 is disposed in thecircuit region RG2 on the direction DR1 side of the circuit region RG3.For example, the power supply circuit 60 is disposed between theoscillation circuit 30, and the temperature sensor circuit 40 and thelogic circuit 50. In other words, at least one of the power supplycircuit and the logic circuit 50 is disposed between the oscillationcircuit 30 and the temperature sensor circuit 40. The circuit region isa region in which circuit elements constituting the circuit and wiringscoupling between the circuit elements are disposed. The circuit elementis an active element such as a transistor or a passive element such as aresistor or a capacitor. For example, in FIG. 2 , the circuit regionsRG1, RG2, and RG3 are rectangular regions. The rectangular regionincludes a region having a substantially rectangular shape. For example,the circuit region RG1 in which the oscillation circuit 30 is disposedis a rectangular region having the direction DR3 along the side SD1 asthe long side direction. The circuit region RG3 in which the powersupply circuit 60 is disposed is also a rectangular region having thedirection DR3 as the long side direction. The circuit region RG2 inwhich the temperature sensor circuit 40 and the logic circuit 50 aredisposed is a rectangular region having the direction DR3 as the longside direction but may be a rectangular region having the direction DR1along the side SD3 as the long side direction. Although the circuitregions RG1, RG2, and RG3 are rectangular regions in FIG. 2 , theregions may be regions having a shape other than a rectangle.

For example, in the present embodiment, in order to reduce the currentconsumption of the circuit device 20, the temperature sensor circuit 40performs the intermittent operation instead of performing a constantoperation. By the temperature sensor circuit 40 performing theintermittent operation, the current consumption of the temperaturesensor circuit 40 can be significantly reduced as compared with the casewhere the temperature sensor circuit 40 performs a constant operation,and as a result, low power consumption of the circuit device 20 can beachieved.

However, when the temperature sensor circuit 40 performs theintermittent operation in this way, as will be described later in FIG. 9and the like, the current consumption fluctuates in an AC manner, andthe signal characteristics such as the jitter characteristics of theoscillation signal OSC deteriorate due to the AC fluctuation in thecurrent consumption. Specifically, the AC fluctuation in the currentconsumption at the temperature sensor circuit 40 is propagated to theoscillation circuit as noise, and the signal characteristics such as thejitter characteristics of the oscillation signal OSC deteriorate. As aresult, the signal characteristics of the clock signal CK based on theoscillation signal OSC deteriorate, and a situation occurs in which theoutput clock signal CKQ having deteriorated signal characteristics isoutput from the circuit device 20 and the oscillator 4.

For example, in JP-A-2015-90973 described above, although it preventsdeterioration of the signal characteristics of the clock signal byseparating the analog circuit region and the digital circuit region,there is no mention of the temperature sensor circuit, and the aboveproblems caused by the intermittent operation of the temperature sensorcircuit is not ascertained. For example, a temperature sensor circuit,which uses an analog voltage, is often used in a temperature compensatedoscillation circuit in the related art, and there is almost no ACfluctuation in current consumption. However, when the temperature sensorcircuit 40 is set to a digital configuration and is set so as to performthe intermittent operation as in the present embodiment, the ACfluctuation in the current consumption is large and the temperaturesensor circuit 40 is a noise source, so that it is also necessary toconsider the disposition of the temperature sensor circuit 40.

Therefore, in the present embodiment, a layout disposition method thatincreases a space between the temperature sensor circuit 40 or the like,which is a noise source generated by the AC fluctuation in the currentconsumption due to the intermittent operation, and the oscillationcircuit 30, which has a small current consumption and is susceptible tonoise, is adopted. Specifically, as illustrated in FIG. 2 , theoscillation circuit 30, which is susceptible to noise, is disposed inthe circuit region RG1, and the temperature sensor circuit 40 and thelogic circuit 50, which become noise sources, are disposed in thecircuit region RG2. The power supply circuit 60 is disposed in thecircuit region RG3, which is positioned between the circuit region RG1and the circuit region RG2. In this way, the power supply circuit 60disposed in the circuit region RG3 is interposed between the circuitregion RG1, in which the oscillation circuit 30 is disposed, and thecircuit region RG2, in which the temperature sensor circuit 40 and thelogic circuit 50 are disposed. Further, by interposing the power supplycircuit disposed in the circuit region RG3 in this way, the distancebetween the oscillation circuit 30, and the temperature sensor circuit40 and the logic circuit 50 is increased. As a result, the ACfluctuation in the current consumption due to the intermittent operationof the temperature sensor circuit 40 becomes noise, and it is possibleto effectively reduce a situation in which an adverse effect is given tothe oscillation operation of the oscillation circuit 30, and the signalcharacteristics such as the jitter characteristics of the oscillationsignal OSC deteriorate.

Specifically, in the present embodiment, the influence of noisegenerated by the interference between the digital circuits and theanalog circuits is reduced by separating the region of the analogcircuit such as the oscillation circuit 30, which has a small currentconsumption and is susceptible to noise, and the regions of the digitalcircuits such as the temperature sensor circuit 40, the logic circuit50, and the output buffer circuit 70, which have a large currentconsumption and generate noise. For example, by separately disposing theregion of the analog circuit such as the oscillation circuit 30 or thepower supply circuit 60, which performs a constant operation, and theregion of the digital circuit such as the temperature sensor circuit 40,which performs the intermittent operation, the influence of noisegenerated by the interference between the circuit performing a constantoperation and the circuit performing the intermittent operation isreduced. For example, among the digital circuits, by making the distancebetween the output buffer circuit 70, which has the largest currentconsumption and is a noise source, and the oscillation circuit 30, whichhas a small current consumption and is most susceptible to noise, as farapart as possible, the adverse effect of noise wraparound to theoscillation circuit 30 is reduced. Further, the temperature sensorcircuit 40 includes the digital circuit that converts temperatureinformation into a digital code and performs the intermittent operationfor low current consumption so that the current consumption during theoperation becomes a noise source to the oscillation circuit 30 in theorder close to that of the output buffer circuit 70. Therefore, theoscillation circuit 30, and the temperature sensor circuit 40 and theoutput buffer circuit 70, which become noise sources, are separatelydisposed, and by disposing the power supply circuit 60, which is lesssusceptible to noise than the oscillation circuit 30 and operates in aDC manner, between the oscillation circuit 30, and the temperaturesensor circuit 40 and the output buffer circuit 70, the noise wraparoundto the oscillation circuit 30 is reduced.

Further, the temperature sensor circuit 40 performs the intermittentoperation of obtaining the temperature data TSQ corresponding to thetemperature during the operation period and stopping the operation ofthe temperature sensor circuit 40 after outputting the obtainedtemperature data TSQ to the logic circuit 50. For example, thetemperature sensor circuit 40 enters the operation enable state duringthe operation period and obtains the temperature data TSQ. For example,in the temperature sensor circuit 40, during the operation period, thering oscillator 42, the counter circuit 44, the regulator 46, and thelike illustrated in FIG. 4 described later enter the operation enablestate, and the temperature data TSQ corresponding to the temperature isobtained. Specifically, the regulated power supply voltage VREG3 fromthe regulator 46 is supplied with respect to each of these circuits, andthe enable signal of each circuit described later becomes active so thatthe operation current flowing through each circuit is turned on and eachcircuit enters the operation enable state. Thereafter, the temperaturesensor circuit 40 outputs the obtained temperature data TSQ to the logiccircuit 50. That is, the temperature data TSQ corresponding to thetemperature measured during the operation period is output to the logiccircuit 50. Further, after the temperature data TSQ is output to thelogic circuit 50, the temperature sensor circuit 40 enters, for example,the operation disable state, and stops the operation thereof. Forexample, during the stop period of the intermittent operation, the ringoscillator 42, the counter circuit 44, the regulator 46, and the likeenter the operation disable state and stop the operation. Specifically,the regulated power supply voltage VREG3 from the regulator 46 is notsupplied with respect to each of these circuits, and the enable signalof each circuit becomes inactive so that the operation current flowingthrough each circuit is turned off and each circuit enters the operationdisable state. By stopping the operation of each circuit of thetemperature sensor circuit 40, the power saving of the temperaturesensor circuit 40 can be achieved. By performing the intermittentoperation in which the temperature sensor circuit 40 repeats theoperation period and the stop period in this way, low power consumptionis realized. The length of the operation period of the temperaturesensor circuit 40 in the intermittent operation is, for example, 50 msor less, and the current consumption of the temperature sensor circuit40 during the operation period is, for example, 10 μA or less. The timerequired for a start is shorter as compared with that of the band gapreference (BGR) circuit described later so that the ring oscillator 42can start the appropriate oscillation operation even for a shortoperation period. Further, by shortening the operation period of thetemperature sensor circuit 40 in this way, low power consumption can berealized. Specifically, the current consumption of the oscillationcircuit 30 is, for example, substantially 100 to 200 nA, the currentconsumption of the logic circuit 50 is, for example, substantially 10 to20 nA, and the current consumption of the power supply circuit 60 is,for example, substantially 100 nA. Even when the current consumption ofthe temperature sensor circuit 40 during the operation period is, forexample, substantially 100 μA, by causing the temperature sensor circuit40 to perform the intermittent operation, it is possible to reduce thecurrent consumption of the temperature sensor circuit 40 on average for1 second to substantially 2 nA.

However, when the intermittent operation, in which the operation periodand the stop period are repeated, is performed, the AC fluctuation ofthe current consumption occurs as described above and there may be apossibility that this becomes noise and gives an adverse effect on theoscillation circuit 30. In this regard, as illustrated in FIG. 2 , inthe present embodiment, the power supply circuit 60 is disposed in thecircuit region RG3 between the circuit region RG1, in which theoscillation circuit 30 is disposed, and the circuit region RG2, in whichthe temperature sensor circuit 40 or the like is disposed. As a result,the distance between the oscillation circuit 30 and the temperaturesensor circuit 40 can be increased. Therefore, even when the ACfluctuation in the current consumption due to such the intermittentoperation occurs, the transmission of noise, which is generated by thefluctuation, to the oscillation circuit 30 is reduced, and thedeterioration of the signal characteristics of the oscillation signalOSC can be reduced.

Further, as illustrated in FIG. 1 , the logic circuit 50 has a latchcircuit 52 that latches the temperature data TSQ output by thetemperature sensor circuit 40 during the operation period. The latchcircuit 52 can be realized by a holding circuit such as a flip-flopcircuit or the like, for example. The logic circuit 50 performs thetemperature compensation processing based on the temperature data TSQlatched by the latch circuit 52 even during the stop period of thetemperature sensor circuit 40. That is, the temperature sensor circuit40 obtains the temperature data TSQ corresponding to the temperatureduring the operation period, and the obtained temperature data TSQ islatched by the latch circuit 52 of the logic circuit 50. Therefore, evenwhen the temperature sensor circuit 40 stops the operation thereof afteroutputting the obtained temperature data TSQ, the obtained temperaturedata TSQ is latched and held by the latch circuit 52 of the logiccircuit 50. Therefore, even when the temperature sensor circuit 40 stopsthe operation in the stop period after the operation period of theintermittent operation, the logic circuit 50 can properly execute thetemperature compensation processing based on the temperature data TSQlatched by the latch circuit 52. That is, the logic circuit 50 isoperated by the regulated power supply voltage VREG2 supplied from thepower supply circuit 60 which performs a constant operation, and thenthe temperature compensation processing can be executed.

As illustrated in FIG. 1 , the circuit device 20 includes the outputbuffer circuit 70 that outputs the output clock signal CKQ based on theoscillation signal OSC. For example, the output buffer circuit 70outputs a signal obtained by buffering the clock signal CK based on theoscillation signal OSC to the clock terminal TCK as the output clocksignal CKQ. Further, as illustrated in FIG. 2 , the output buffercircuit 70 is disposed in the circuit region RG2 which is the secondcircuit region. That is, in addition to the temperature sensor circuit40 and the logic circuit 50, the output buffer circuit 70 is alsodisposed in the circuit region RG2. In this way, the power supplycircuit 60 is disposed in the circuit region RG3 between the circuitregion RG1, in which the oscillation circuit 30 is disposed, and thecircuit region RG2 in which the output buffer circuit 70 is disposed. Asa result, the distance between the oscillation circuit 30 and the outputbuffer circuit 70 can be increased. Therefore, the transmission ofnoise, which is generated by the output buffer circuit that buffers theclock signal CK, to the oscillation circuit 30 is reduced, and thedeterioration of the signal characteristics of the oscillation signalOSC can be reduced.

Specifically, as illustrated in FIG. 2 , the output buffer circuit 70 isdisposed between the clock terminal TCK and the logic circuit 50. Forexample, the output buffer circuit 70 is disposed next to the clockterminal TCK. In this way, the clock signal CK, which is output by thelogic circuit 50 based on the oscillation signal OSC, is input to theoutput buffer circuit 70 with a short path route and buffered, and isoutput from the clock terminal TCK as the output clock signal CKQ. As aresult, it becomes possible to reduce deterioration of the signalcharacteristics of the output clock signal CKQ caused by the parasiticresistance and the parasitic capacitor in the route.

Further, as illustrated in FIG. 2 , the circuit region RG1, which is thefirst circuit region, is a circuit region along the side SD1, which isthe first side of the circuit device 20. Further, the circuit regionRG2, which is the second circuit region, is a circuit region along theside SD2, which is the second side of the circuit device 20. Forexample, the circuit region RG1 is a circuit region having the side SD1as a long side, and the oscillation circuit 30 is disposed in thiscircuit region RG1. Further, the circuit region RG2 is a circuit regionhaving the side SD2, which is an opposite side of the side SD1 as thelong side, and the temperature sensor circuit 40 and the logic circuit50 are disposed in this circuit region RG2. In this way, the oscillationcircuit 30 is disposed on the side SD1 side of the circuit device 20,and the temperature sensor circuit 40 and the logic circuit 50 aredisposed on the side SD2 side, which is an opposite side of the side SD1of the circuit device 20. Therefore, in the semiconductor chip of thecircuit device 20, the distance between the oscillation circuit 30, thetemperature sensor circuit 40 and the logic circuit 50 can be increasedas much as possible, and the transmission of noise, which is generatedfrom the temperature sensor circuit 40 or the logic circuit 50, to theoscillation circuit 30 can be further reduced.

The circuit device 20 also includes the power supply terminal TVDD towhich the power supply voltage VDD is input. That is, the power supplyterminal TVDD for supplying the VDD that is an external power supplyvoltage from an external power supply device is included. As illustratedin FIG. 2 , the power supply terminal TVDD and the temperature sensorcircuit 40 are disposed side by side along the side SD3 intersecting theside SD1 and the side SD2 of the circuit device 20. For example, thepower supply terminal TVDD and the temperature sensor circuit 40 aredisposed side by side in the order of the power supply terminal TVDD andthe temperature sensor circuit 40 along the side SD3. For example, whena direction from the side SD1 toward the side SD2 is defined as DR1, thetemperature sensor circuit 40 is disposed on the direction DR1 side ofthe power supply terminal TVDD. The direction DR1 is a direction alongthe side SD3. By arranging the power supply terminal TVDD and thetemperature sensor circuit 40 side by side along the side SD3 in thisway, since the power supply voltage VDD can be supplied to thetemperature sensor circuit 40 from the power supply terminal TVDD withthe short path route, the parasitic resistance and the like in the routecan be sufficiently reduced. Therefore, when the AC fluctuation of thecurrent consumption occurs due to the intermittent operation of thetemperature sensor circuit 40, it is possible to minimize voltagefluctuations due to parasitic resistance or the like in the route fromthe power supply terminal TVDD to the temperature sensor circuit 40, andit is also possible to reduce noise caused by AC fluctuations in currentconsumption.

The circuit device 20 also includes the clock terminal TCK to which theoutput clock signal CKQ based on the oscillation signal OSC is output.The temperature sensor circuit 40 is disposed between the power supplyterminal TVDD and the clock terminal TCK. When the direction from theside SD1 toward the side SD2 is defined as DR1, the clock terminal TCKis disposed on the direction DR1 side of the temperature sensor circuit40. For example, the power supply terminal TVDD, the temperature sensorcircuit 40, and the clock terminal TCK are disposed side by side alongthe side SD3 in the order of the power supply terminal TVDD, thetemperature sensor circuit 40, and the clock terminal TCK. Further, theoutput buffer circuit 70 is disposed near the clock terminal TCK and thetemperature sensor circuit 40. By disposing the temperature sensorcircuit 40 between the power supply terminal TVDD and the clock terminalTCK in this way, the temperature sensor circuit 40, the clock terminalTCK, and the output buffer circuit 70, which become the noise sources,can be arranged collectively at a place along the side SD3, for example.Therefore, the layout disposition that keeps the distance between thesenoise sources and the oscillation circuit 30 as far apart as possiblebecomes easy, and the transmission of noise, which is generated from thenoise source, to the oscillation circuit 30 can be reduced.

The circuit device 20 includes the clock terminal TCK from which theoutput clock signal CKQ based on the oscillation signal OSC is output,and the clock terminal TCK is disposed at a corner portion in which theside SD3 and the side SD2 of the circuit device 20 intersect. That is,the clock terminal TCK is disposed at the corner portion that is aregion in which the side SD3, where the side SD1 and side SD2 intersect,and the side SD2 intersect. In this way, the clock terminal TCK, whichis a noise source, or the output buffer circuit 70, which outputs theoutput clock signal CKQ to the clock terminal TCK, can be disposed atthe corner portion in which the side SD3 and the side SD2 intersect.Therefore, for example, a distance between the oscillation circuit 30,which is disposed in the circuit region RG1 that is the region along theside SD1, and the noise source, which is generated by the output clocksignal CKQ of the clock terminal TCK, can be increased as much aspossible, and the transmission of noise, which is generated by the noisesource, to the oscillation circuit 30 can be further reduced.

Further, the circuit device 20 includes a power supply terminal TVDD towhich a power supply voltage VDD is input and a ground terminal TGND towhich a ground voltage GND is input. The power supply terminal TVDD andthe ground terminal TGND are diagonally disposed in the circuit regionRG2, which is the second circuit region. For example, the power supplyterminal TVDD is disposed at a first corner portion in the circuitregion RG2, and the ground terminal TGND is disposed at a second cornerportion in the circuit region RG2, which is diagonal to the first cornerportion. In this way, as will be described in detail in FIG. 13described later, the power supply voltage VDD of the circuit in thecircuit region RG2 can be supplied by using a power supply line, whichis coupled to the power supply terminal TVDD and wired to the circuitregion RG2, and the ground voltage GND of the circuit in the circuitregion RG2 can be supplied by using a ground line, which is coupled tothe ground terminal TGND and wired to the circuit region RG2. Therefore,the noise, which is generated in the temperature sensor circuit 40 orthe logic circuit 50 in the circuit region RG2, is absorbed by the powersupply terminal TVDD or the ground terminal TGND side via the powersupply line or the ground line wired in the circuit region RG2, and thenthe transmission of noise to the oscillation circuit 30 can be reduced.

2. Oscillation Circuit and Temperature Sensor Circuit

Next, an example of a configuration of the oscillation circuit 30 andthe temperature sensor circuit 40 will be described. FIG. 3 illustratesan example of a configuration of the oscillation circuit 30. Note thatthe oscillation circuit 30 of the present embodiment is not limited tothe configuration illustrated in FIG. 3 , and some of the components maybe omitted, other components may be added, or various modifications canbe made, such as changing the component to another type of component.

As illustrated in FIG. 3 , the oscillation circuit includes invertercircuits DV1 and DV2 and variable capacitance circuits CV1 and CV2. Theinverter circuit DV1 is a drive circuit of the vibrator 10, an inputnode thereof is coupled to one end of the vibrator 10, and an outputnode thereof is coupled to the other end of the vibrator 10. Theinverter circuit DV2 buffers the output signal of the inverter circuitDV1 and outputs the output signal as an oscillation signal OSC. Theinverter circuits DV1 and DV2 are supplied with the VREG1 as a powersupply voltage on the high potential side, supplied with the GND as apower supply voltage on the low potential side, and operated.

One end of the variable capacitance circuit CV1 is coupled to one end ofthe vibrator 10 and the other end thereof is coupled to the GND node.Specifically, the variable capacitance circuit CV1 includes a firstcapacitor array, in which one end thereof is coupled to one end of thevibrator 10, and a first switch array, in which one end thereof iscoupled to the other end of the first capacitor array and the other endthereof is coupled to the GND node. The capacitance value of thevariable capacitance circuit CV1 is adjusted by controlling the ON/OFFof the plurality of switches of the first switch array by using thefrequency control data generated based on the temperature data TSQ.Similarly, one end of the variable capacitance circuit CV2 is coupled tothe other end of the vibrator 10 and the other end thereof is coupled tothe GND node. Specifically, the variable capacitance circuit CV2includes a second capacitor array, in which one end thereof is coupledto the other end of the vibrator 10, and a second switch array, in whichone end thereof is coupled to the other end of the second capacitorarray and the other end thereof is coupled to the GND node. Further, thecapacitance value of the variable capacitance circuit CV2 is adjusted bycontrolling the ON/OFF of the plurality of switches of the second switcharray by using the frequency control data generated based on thetemperature data TSQ. By adjusting the capacitance values of thevariable capacitance circuits CV1 and CV2 in this way, the oscillationfrequency of the oscillation signal OSC of the oscillation circuit 30 iscontrolled, and the temperature compensation processing for theoscillation frequency is realized.

FIG. 4 illustrates an example of a configuration of the temperaturesensor circuit 40. Note that the temperature sensor circuit 40 of thepresent embodiment is not limited to the configuration illustrated inFIG. 4 , and some of the components may be omitted, other components maybe added, or various modifications can be made, such as changing thecomponent to another type of component.

The temperature sensor circuit 40 includes a ring oscillator 42, acounter circuit 44, and a regulator 46. The ring oscillator 42 is acircuit in which a plurality of delay elements are coupled in a ringshape. Specifically, the ring oscillator 42 is a circuit in which signalinversion circuits such as an odd number of inverter circuits arecoupled in a ring shape, as illustrated in FIG. 10 described later, andoutputs an output pulse signal RCK which is an oscillation signal. Thecounter circuit 44 performs count processing of the number of pulses ofthe output pulse signal RCK for the ring oscillator 42 by using theclock signal CK based on the oscillation signal OSC. Thereafter, thetemperature data TSQ based on the count value obtained by the countprocessing is output. For example, as illustrated in FIG. 5 , thecounter circuit 44 obtains the temperature data TSQ by obtaining thecount value of the number of pulses of the output pulse signal RCK in acount period TSENS that is defined by the clock signal CK. For example,in FIG. 5 , the count period TSENS is a period corresponding to m=7clocks of the clock signal CK. The counter circuit 44 counts the numberof pulses of the output pulse signal RCK during the count period TSENS.The regulator 46 supplies the regulated power supply voltage VREG3 tothe ring oscillator 42. In FIG. 4 , the regulator 46 also supplies theregulated power supply voltage VREG3 to the current setting circuit 48and the counter circuit 44. For example, the regulator 46 generates theregulated power supply voltage VREG3 by regulating the power supplyvoltage VDD. For example, as illustrated in FIG. 4 , the regulator 46has an operational amplifier OPB, and resistors RB1 and RB2. Theregulated power supply voltage VREG3 is generated by using the referencevoltage generated by the difference in work function WF of anoperational amplifier OPB. According to the configuration in FIG. 4 ,the temperature sensor circuit 40 capable of performing a low voltageoperation with low power consumption can be realized by using asmall-scale circuit.

As illustrated in FIG. 4 , the temperature sensor circuit 40 includesthe current setting circuit 48. The current setting circuit 48 operatesbased on the regulated power supply voltage VREG3 generated by theregulator 46 and sets the operation current of the ring oscillator 42.For example, the current setting circuit 48 generates bias voltages VBP2and VBN2 for setting the operation current flowing through the invertercircuits IVA1, IVA2, IVA3, and IVA4 of the regulator 46 illustrated inFIG. 10 , which will be described later. This operation current can alsobe called a bias current based on the bias voltages VBP2 and VBN2. Byproviding such a current setting circuit 48 and setting the operationcurrent of the ring oscillator 42, the oscillation frequency of the ringoscillator 42 can be controlled. For example, the current settingcircuit 48 sets the operation current, which is a bias current of theregulator 46 so that a current value increases as the temperatureincreases. In this way, it is possible to realize frequency control inwhich the oscillation frequency of the ring oscillator 42 increases asthe temperature increases.

For example, FIG. 6 illustrates an example of characteristics offrequency deviation of the clock signal CK and the output pulse signalRCK with respect to the temperature. In FIG. 6 , an example of thecharacteristics on the left side is an enlarged example of the verticalaxis of an example of the characteristics on the right side. Asillustrated in the example of the characteristics on the right side inFIG. 6 , the frequency of the output pulse signal RCK, which is theoscillation frequency of the ring oscillator 42, increases as thetemperature increases. This is realized by controlling the operationcurrent of the ring oscillator 42 by the current setting circuit 48.

For example, an oscillator having a relatively low frequency such as 32KHz is required to have low power consumption, low voltage operation,and miniaturization for sensor-related applications such as the Internetof things (IoT). However, the temperature sensor circuit in the relatedart has a problem that it is difficult to achieve both low currentconsumption and low voltage operation and to configure a small-sizedtemperature sensor circuit. For example, a high accuracy oscillator witha built-in temperature control function requires the temperature sensorcircuit. However, when the temperature sensor circuit is constituted bya band gap reference (BGR) circuit and an A/D conversion circuit, it isdifficult to achieve low current consumption or low voltage operation.For example, in order to generate a voltage proportional to thetemperature, it is necessary to pass a certain amount or more of currentthrough the bipolar transistor of the BGR circuit, and it is difficultto achieve low power consumption. Further, in order to increase theresolution of temperature detection, a dynamic range of the voltageinput to the A/D conversion circuit is required so that it is difficultto achieve low voltage operation. Further, the capacitance DAC type A/Dconversion circuit has a large capacitance area, and it is difficult toachieve miniaturization in order to ensure accuracy.

In FIG. 4 , a frequency comparison type temperature sensor circuit 40 isused. That is, the temperature sensor circuit 40 is constituted by thebuilt-in ring oscillator 42 whose oscillation frequency depends on thetemperature, and the counter circuit 44 for counting the output pulsesignal RCK of the ring oscillator 42. The ring oscillator 42 is anoscillation circuit controlled by a bias current depending on thetemperature. Further, the reference clock signal of the counter circuit44 is, for example, a clock signal CK of 32 KHz, which is theoscillation frequency of the oscillation circuit 30. Thereby, thecurrent consumption is reduced by making the temperature sensor circuit40 perform the intermittent operation, and preventing the signal of thecount value in the counter circuit 44 from being transmitted to thelogic circuit 50 during the count period TSENS.

Further, in order to reduce noise to be sneaking into circuits otherthan the temperature sensor circuit 40 due to the intermittent operationof the temperature sensor circuit 40, the power supply voltage of thetemperature sensor circuit 40 uses the regulated power supply voltageVREG3 that is generated by the dedicated regulator 46. For example, theregulators 61 and 62 in FIG. 1 that generate the regulated power supplyvoltages VREG1 and VREG2 supplied to the oscillation circuit 30 and thelogic circuit 50, are disposed in a region of the power supply circuit60 in FIG. 2 . In contrast to this, the regulator 46 in FIG. 4 thatgenerates the regulated power supply voltage VREG3 supplied to thetemperature sensor circuit 40, is disposed in a region of thetemperature sensor circuit 40 in FIG. 2 .

Since the count period TSENS illustrated in FIG. 5 is variable bysetting a register provided in the logic circuit 50, for example, theresolution which is the sensitivity of temperature detection can becustomized according to the specifications. Further, in FIG. 4 , theconfiguration is such that the frequencies are compared by the countercircuit 44 so that the BGR circuit and the A/D conversion circuit arenot required, and the current consumption and the circuit scale can bereduced. Further, since the ring oscillator 42 and the counter circuit44 operate even with a low power supply voltage of, for example,substantially 1.2 V, the lower limit voltage for operation can be low,and since the resolution of temperature detection can be ensured bylengthening the count period TSENS, the resolution can also be ensured.Further, although there are individual differences in the frequency ofthe ring oscillator 42, by adjusting the logic circuit 50 provided inthe subsequent stage of the counter circuit 44, it becomes possible tocorrespond to an address range of the lookup table for temperaturecompensation.

FIGS. 7 and 8 are detailed explanatory views of an operation of thetemperature sensor circuit 40. FIG. 7 schematically illustrates anexample of a detailed configuration of the counter circuit 44, and FIG.8 illustrates a view of a signal waveform describing the circuitoperation in FIG. 7 . First, at a timing t1 in FIG. 8 , the signalTSONVDD becomes a high level which is an active level, the regulator 46is started, and the regulated power supply voltage VREG3 is activated.Further, a negative logic reset signal TSXRST becomes a low level whichis an active level, the counter circuit 44 becomes a reset state, and acount value CNT1 of the counter CT becomes zero. A count value CNT2output by the AND circuit AN1 to which the count value CNT1 is inputalso becomes zero. Next, the signals TSONROSC and TSONIREF become a highlevel after one cycle of the clock signal CK from the timing t1, and thering oscillator 42 and the current setting circuit 48 are started.Thereafter, when the signal TSONROSC becomes a high level, the signal ofthe count value CNT2 which is the output of the AND circuit AN1 to whichthe inverted signal of this high level signal is input, is fixed to alow level. As a result, the signals of the count values CNT1 and CNT2during the count period TSENS of the counter CT are not transmitted tothe logic circuit 50, and low power consumption can be achieved.

Next, the count processing for the counter CT is started at a timing t2after the lapse of the period TSRST from the timing t1. For example, ittakes a certain amount of time from when the signal TSONROSC becomes ahigh level and the ring oscillator 42 is started until the oscillationfrequency stabilizes. Therefore, the period TSRST for ensuring the timeis set, and after the period TSRST elapses from the timing t1, thecounter CT starts the count processing for the number of pulses of theoutput pulse signal RCK from the ring oscillator 42. The length of theperiod TSRST can be set by a register. As described in FIG. 5 , duringthe count period TSENS, which is a period of the length of m clocks (mis an integer of 2 or more) of the clock signal CK, the counter CTperforms the count processing for the number of pulses of the outputpulse signal RCK and outputs the result of the count processing as thecount value CNT1. Thereafter, the count processing is ended at a timingt3, and the count value CNT1 at that time is output to the logic circuit50 as the temperature data TSQ via the AND circuit AN1 and the ANDcircuit AN2. At a timing t4, the latch circuit 52 of the logic circuit50 latches the temperature data TSQ from the temperature sensor circuit40. As a result, the temperature data TSDATA that is held in the latchcircuit 52 is updated from the n-th temperature data to the next(n+1)-th temperature data. Thereafter, the logic circuit 50 performs thetemperature compensation processing for the oscillation frequency basedon the temperature data TSDATA held in the latch circuit 52.

FIG. 9 is an explanatory view of deterioration of signal characteristicsof the oscillation signal OSC generated due to the intermittentoperation of the temperature sensor circuit 40. When the temperaturesensor circuit 40 performs the intermittent operation, as illustrated inA1 in FIG. 9 , a situation occurs in which the current consumption ofthe temperature sensor circuit fluctuates in an AC manner. As a result,noise is generated on the ground line to which GND is supplied asillustrated in A2, and the noise is superimposed with respect to thesignal in the oscillation circuit 30 as illustrated in A3 and A4. As aresult, as illustrated in A5, jitter is generated in the oscillationsignal OSC output from the oscillation circuit 30, the signal quality ofthe oscillation signal OSC deteriorates, and the signal characteristicsof the clock signal CK also deteriorate. In this case, in the presentembodiment, as illustrated in FIG. 2 , since a distance between thetemperature sensor circuit 40, which performs the intermittentoperation, and the oscillation circuit 30 can be increased, thegeneration of such jitter can be reduced.

FIG. 10 illustrates an example of a configuration of a ring oscillator42. The ring oscillator 42 includes a NAND circuit NAA, invertercircuits IVA1, IVA2, IVA3, and IVA4 coupled in a ring shape. An invertercircuit IVA5, which is a buffer circuit, is also included. By couplingthese odd number of signal inversion circuits in a ring shape, it ispossible to generate the output pulse signal RCK which is theoscillation signal. Note that an enable signal ENROSC for enabling ordisabling the operation of the ring oscillator 42 is input to the NANDcircuit NAA. When the enable signal ENROSC is activated or deactivatedby the logic circuit 50, the intermittent operation of the ringoscillator 42 is performed, and the intermittent operation of thetemperature sensor circuit 40 is realized. Further, P-type transistorsTA1, TA2, TA3, and TA4 for passing an operation current are provided onthe VREG3 side of the inverter circuits IVA1, IVA2, IVA3, and IVA4, andN-type transistors TA5, TA6, TA7, and TA8 are provided on the GND side.Further, the bias voltage VBP2 from the current setting circuit 48 isinput to the gates of the transistors TA1 to TA4, and the bias voltageVBN2 from the current setting circuit 48 is input to the gates of thetransistors TA5 to TA8. As a result, the operation current of the ringoscillator 42 is controlled, and the ring oscillator 42 can output theoutput pulse signal RCK whose frequency increases as the temperatureincreases, for example.

FIG. 11 illustrates an example of a configuration of a regulator 46.Note that, the regulators 61 and 62 in FIG. 1 can also be realized bythe same circuit configuration as that of FIG. 11 . As illustrated inFIG. 11 , the regulator 46 includes the operational amplifier OPB, andthe resistors RB1 and RB2. The operational amplifier OPB has adifferential portion constituted by the transistors TB1, TB2, TB3, TB4,and TB5, and an output portion constituted by the transistors TB6 andTB7. Note that, an enable signal ENVREG3 for enabling or disabling theoperation of the regulator 46 is input to the transistor TB8. When theenable signal ENVREG3 is activated or deactivated by the logic circuit50, the intermittent operation of the regulator 46 is performed, and theintermittent operation of the temperature sensor circuit 40 is realized.In FIG. 11 , the regulated power supply voltage VREG3 is generated byutilizing the difference in work function WF of the N-type transistorsTB3 and TB4 constituting a differential pair. For example, the voltageof VREG3 is set based on the voltage of the difference in work functionWF and the resistance values of the resistors RB1 and RB2.

FIG. 12 illustrates an example of a configuration of the current settingcircuit 48. In FIG. 12 , a bias voltage VBN1 is generated by the biasvoltage generation circuit constituted by the transistors TC1, TC2, TC3,TC4, TC5, TC6, TC7, and TC8. Thereafter, the bias voltages VBP2 and VBN2corresponding to the bias voltage VBN1 are generated by the currentmirror circuit constituted by the transistors TC9, TC10, TC11, and TC12and supplied to the ring oscillator 42 in FIG. 10 , and the operationcurrent of the ring oscillator 42 is set. Note that, the enable signalsENIREF and XENIREF for enabling or disabling the operation of thecurrent setting circuit 48 are input to the transistors TC13 and TC14.When the enable signals ENIREF and XENIREF are activated or deactivatedby the logic circuit 50, the intermittent operation of the currentsetting circuit 48 is performed, and the intermittent operation of thetemperature sensor circuit 40 is realized.

3. Power Supply Line and Ground Line Wiring

FIG. 13 illustrates an example of wirings of a power supply line and aground line in the circuit device 20 of the present embodiment. Asillustrated in FIG. 13 , the circuit device 20 of the present embodimentincludes the oscillation circuit 30, the temperature sensor circuit thatperforms the intermittent operation, the logic circuit 50 that performsthe temperature compensation processing, the power supply terminal TVDDto which the power supply voltage VDD is input, and the ground terminalTGND to which the ground voltage GND is input. Further, the oscillationcircuit 30 is disposed in the circuit region RG1, and the temperaturesensor circuit 40 and the logic circuit 50 are disposed in the circuitregion RG2. As illustrated in FIG. 13 , the power supply terminal TVDDand the ground terminal TGND are diagonally disposed in the circuitregion RG2. That is, the power supply terminal TVDD is disposed at thefirst corner portion in the circuit region RG2, and the ground terminalTGND is disposed at the second corner portion facing the first cornerportion in the circuit region RG2. In this way, the power supply voltageVDD of the circuit in the circuit region RG2 can be supplied by using apower supply line, which is coupled to the power supply terminal TVDDand wired to the circuit region RG2, and the ground voltage GND of thecircuit in the circuit region RG2 can be supplied by using a groundline, which is coupled to the ground terminal TGND and wired to thecircuit region RG2. Therefore, the transmission of noise, which isgenerated from the temperature sensor circuit 40, the logic circuit 50,or the like in the circuit region RG2, to the oscillation circuit 30 canbe effectively reduced.

Specifically, as illustrated in FIG. 13 , the circuit device 20 includesthe power supply line LV1 and the ground line LG1. The LV1 is a firstpower supply line, and the LG1 is a first ground line. The power supplyline LV1 is coupled to the power supply terminal TVDD, is wired in thecircuit region RG1, and supplies the power supply voltage VDD to theoscillation circuit 30 in the circuit region RG1. The ground line LG1 iscoupled to the ground terminal TGND, is wired in the circuit region RG1,and supplies the ground voltage GND to the oscillation circuit 30 in thecircuit region RG1. Further, the circuit device includes power supplylines LV2A and LV2B and ground lines LG2A and LG2B. The LV2A and LV2Bare second power supply lines, and the LG2A and LG2B are second groundlines. The power supply lines LV2A and LV2B are coupled to the powersupply terminal TVDD, are wired in the circuit region RG2 by branchingoff from the power supply terminal TVDD separately from the power supplyline LV1, and supply the power supply voltage VDD to the temperaturesensor circuit 40, the logic circuit 50, and the like in the circuitregion RG2. Specifically, the power supply line LV2A supplies the VDD tothe temperature sensor circuit 40 and the output buffer circuit 70, andthe power supply line LV2B supplies the VDD to the logic circuit 50.Further, the ground lines LG2A and LG2B are coupled to the groundterminal TGND, are wired in the circuit region RG2 by branching off fromthe ground terminal TGND separately from the ground line LG1, and supplythe ground voltage GND to the temperature sensor circuit 40, the logiccircuit 50, and the like in the circuit region RG2. Specifically, theground line LG2A supplies the GND to the temperature sensor circuit 40and the output buffer circuit 70, and the ground line LG2B supplies theGND to the logic circuit 50. Note that the circuit device 20 can includethe power supply line LV3 and the ground line LG3. The LV3 is a thirdpower supply line, and the LG3 is a third ground line. The power supplyline LV3 is coupled to the power supply terminal TVDD, is wired in thecircuit region RG3 by branching off from the power supply terminal TVDDseparately from the power supply lines LV1, LV2A, and LV2B, and suppliesthe power supply voltage VDD to the power supply circuit 60 in thecircuit region RG3. Further, the ground line LG3 is coupled to theground terminal TGND, is wired in the circuit region RG3 by branchingoff from the ground terminal TGND separately from the ground lines LG1,LG2A, and LG2B, and supplies the ground voltage GND to the power supplycircuit 60 in the circuit region RG3.

As described above, in FIG. 13 , the oscillation circuit 30 is suppliedwith the VDD by the power supply line LV1 that is wired from the powersupply terminal TVDD and supplied with the GND by the ground line LG1that is wired from the ground terminal TGND. On the other hand, thetemperature sensor circuit 40, the logic circuit 50, and the like aresupplied with the VDD by the power supply lines LV2A and LV2B, which arewired by branching off from the power supply terminal TVDD separatelyfrom the power supply line LV1, and supplied with the GND by the groundlines LG2A and LG2B, which are wired by branching off from the groundterminal TGND separately from the ground line LG1. That is, the powersupply line LV1 and the power supply lines LV2A and LV2B are wired bybranching off separately from the power supply terminal TVDD. Theoscillation circuit 30 is supplied with the VDD by the power supply lineLV1, and the temperature sensor circuit 40, the logic circuit 50, andthe like are supplied with the VDD by the power supply lines LV2A andLV2B. Further, the ground line LG1 and the ground lines LG2A and LG2Bare wired by branching off separately from the ground terminal TGND. Theoscillation circuit 30 is supplied with the GND by the ground line LG1,and the temperature sensor circuit 40, the logic circuit 50, and thelike are supplied with the GND by the ground lines LG2A and LG2B. Inthis way, the noise generated in the temperature sensor circuit 40, thelogic circuit 50 in the circuit region RG2, and the like is absorbed bythe power supply terminal TVDD side and the ground terminal TGND sidevia the power supply lines LV2A and LV2B and the ground lines LG2A andLG2B. Further, the noise is less likely to be transmitted to the powersupply line LV1 and the ground line LG1 sides whose wiring impedancesare higher than the impedances on the power supply terminal TVDD and theground terminal TGND sides. As a result, it becomes possible toeffectively reduce a situation in which noise generated in thetemperature sensor circuit 40, the logic circuit 50, or the like istransmitted to the oscillation circuit 30 and the signal characteristicsof the oscillation signal OSC deteriorate.

In FIG. 13 , the power supply terminal TVDD and the ground terminal TGNDare diagonally disposed in the circuit region RG2. By arranging thepower supply terminal TVDD and the ground terminal TGND diagonally inthis way, the power supply line LV1 and the power supply lines LV2A andLV2B can be easily wired by branching off separately at a place of thepower supply terminal TVDD, and the ground line LG1 and the ground linesLG2A and LG2B can be easily wired by branching off separately at a placeof the ground terminal TGND. For example, it is possible to easily wirein a direction along the side SD3 such that the power supply line LV2Aand the ground line LG2A pass near the temperature sensor circuit 40 andthe output buffer circuit 70. Further, the power supply line LV2B andthe ground line LG2B can be easily wired in a ring shape so as tosurround the logic circuit 50, for example. On the other hand, the powersupply line LV1 and the ground line LG1 can be easily branched and wiredwith respect to the circuit region RG1 of the oscillation circuit 30,which is on the side SD1 side with respect to the circuit region RG2, bypulling out the power supply line LV1 and the ground line LG1 to theside SD1 side from the circuit region RG2 in which the power supplyterminals TVDD and ground terminal TGND are diagonally disposed.Therefore, it becomes possible to wire the power supply line or theground line in an efficient layout disposition while reducing thetransmission of noise, which is from the circuit region RG2, to thecircuit region RG1. The circuits that become noise sources, such as thetemperature sensor circuit 40, the logic circuit 50, and the outputbuffer circuit 70, are collectively disposed in the circuit region RG2in which the power supply terminal TVDD and the ground terminal TGND arediagonally disposed, and the noise from these noise sources is alsoeasily absorbed by the power supply terminal TVDD or the ground terminalTGND, which are diagonally disposed in the circuit region RG2.Therefore, it is possible to realize both efficiency of layoutdisposition and noise reduction at the same time.

The noise in the circuit region RG2 may be transmitted to the circuitregion RG1 via, for example, a P-type substrate of the circuit device20. In this regard, in FIG. 13 , by disposing the layout in which thecircuit region RG3 is interposed between the circuit region RG2 and thecircuit region RG1, the distance between the circuit region RG2 and thecircuit region RG1 can be increased, and the transmission of noise viathe substrate can be effectively reduced.

4. Examples of Other Layout Dispositions

FIG. 14 illustrates an example of another layout disposition of thecircuit device 20 of the present embodiment. The layout disposition inFIG. 14 is different from that of FIG. 2 in the disposition position ofthe temperature sensor circuit 40. For example, in FIG. 2 , thetemperature sensor circuit 40 is disposed along the side SD3, but inFIG. 14 , the temperature sensor circuit 40 is disposed along the sideSD4 which is an opposite side of the side SD3. Specifically, the circuitdevice 20 includes the ground terminal TGND to which the ground voltageGND is input, and in FIG. 14 , the temperature sensor circuit 40 and theground terminal TGND are disposed side by side along the side SD4intersecting the side SD1 and the side SD2 of the circuit device 20. Forexample, the temperature sensor circuit 40 and the ground terminal TGNDare disposed side by side along the side SD4 in the order of thetemperature sensor circuit 40 and the ground terminal TGND. For example,when the direction from the side SD1 toward the side SD2 is defined asDR1, the ground terminal TGND is disposed on the direction DR1 side ofthe temperature sensor circuit 40. By arranging the temperature sensorcircuit 40 and the ground terminal TGND side by side along the side SD4in this way, since the ground voltage GND can be supplied to thetemperature sensor circuit 40 from the ground terminal TGND with theshort path route, the parasitic resistance and the like in the route canbe sufficiently reduced. Therefore, when the AC fluctuation of thecurrent consumption occurs due to the intermittent operation of thetemperature sensor circuit 40, it is possible to minimize voltagefluctuations due to parasitic resistance or the like in the route fromthe temperature sensor circuit 40 to the ground terminal TGND, and it isalso possible to reduce the level of noise caused by AC fluctuations incurrent consumption.

As described above, in the present embodiment, as illustrated in FIGS. 2and 14 , the power supply terminal TVDD and the temperature sensorcircuit 40, or the ground terminal TGND and the temperature sensorcircuit 40 are disposed side by side along the side SD3 or the side SD4which is the side intersecting the side SD1 and the side SD2.

FIG. 15 illustrates an example of still another layout disposition ofthe circuit device 20 of the present embodiment. The layout dispositionin FIG. 15 is different from that of FIG. 2 in the disposition positionof the temperature sensor circuit 40. For example, in FIG. 2 , thetemperature sensor circuit 40 is disposed along the side SD3, but inFIG. 14 , the temperature sensor circuit 40 is disposed along the sideSD2. For example, in FIG. 15 , the oscillation circuit 30 is disposedalong the side SD1, and the temperature sensor circuit 40 is disposedalong the side SD2 which is an opposite side of the side SD1. Forexample, the oscillation circuit 30 is disposed along the side SD1 sothat the side SD1 becomes the long side direction, and the temperaturesensor circuit 40 is disposed along the side SD2 so that the side SD2becomes the long side direction. When the temperature sensor circuit 40is disposed along the side SD2 which is an opposite side of the side SD1where the oscillation circuit 30 is disposed in this way, as comparedwith FIG. 2 or 14 , the distance between the oscillation circuit 30 andthe temperature sensor circuit can be further increased. As a result, itbecomes possible to further reduce the transmission of noise, which isgenerated by the intermittent operation of the temperature sensorcircuit 40, to the oscillation circuit 30. Note that, the layoutdisposition of the circuit device 20 of the present embodiment is notlimited to the examples of dispositions in FIGS. 2, 14, and 15 , andvarious modifications can be used.

5. Oscillator

FIG. 16 illustrates a structural example of the oscillator 4 of thepresent embodiment. The oscillator 4 has the vibrator 10, the circuitdevice 20, and the package 15 that accommodates the vibrator 10 and thecircuit device 20. The package 15 is made of, for example, ceramic orthe like, and has an accommodation space inside thereof, and thevibrator 10 and the circuit device 20 are accommodated in theaccommodation space. The accommodation space is hermetically sealed andis preferably in a reduced pressure state that is close to a vacuumstate. With the package 15, the vibrator 10 and the circuit device 20can be suitably protected from impact, dust, heat, moisture, and thelike.

The package 15 has a base 16 and a lid 17. Specifically, the package 15includes a base 16 that supports the vibrator 10 and the circuit device20, and a lid 17 that is bonded to the top surface of the base 16 so asto form an accommodation space with the base 16. And the vibrator 10 issupported by the step portion provided inside the base 16 via theterminal electrode. The circuit device 20 is disposed on the innerbottom surface of the base 16. Specifically, the circuit device 20 isdisposed such that the active surface faces the inner bottom surface ofthe base 16. The active surface is a surface on which the circuitelements of the circuit device 20 are formed. Further, bumps BMP areformed on terminals of the circuit device 20. The circuit device 20 issupported on the inner bottom surface of the base 16 via the conductivebumps BMP. The conductive bump BMP is, for example, a metal bump, andthe vibrator 10 and the circuit device 20 are electrically coupled toeach other via the bump BMP, the internal wiring of the package 15, theterminal electrode, or the like. The circuit device 20 is electricallycoupled to the external terminals 18 and 19 of the oscillator 4 via thebumps BMP or the internal wiring of the package 15. The externalterminals 18 and 19 are formed on the outer bottom surface of thepackage 15. The external terminals 18 and 19 are coupled to an externaldevice via the external wirings. The external wiring is, for example, awiring or the like formed on a circuit substrate on which an externaldevice is mounted. Thereby, a clock signal or the like can be output tothe external device.

In FIG. 16 , the circuit device 20 is flip-mounted so that the activesurface of the circuit device 20 faces downward, but the presentembodiment is not limited to such mounting. For example, the circuitdevice 20 may be mounted so that the active surface of the circuitdevice 20 faces upward. That is, the circuit device 20 is mounted sothat the active surface faces the vibrator 10.

As described above, the circuit device of the present embodimentincludes the oscillation circuit that oscillates the vibrator togenerate an oscillation signal, the temperature sensor circuit thatperforms the intermittent operation, the logic circuit that performs thetemperature compensation processing based on the output of thetemperature sensor circuit, and the power supply circuit that suppliespower to the oscillation circuit. The oscillation circuit is disposed inthe first circuit region, the temperature sensor circuit and the logiccircuit are disposed in the second circuit region, and the power supplycircuit is disposed in the third circuit region, which is positionedbetween the first circuit region and the second circuit region.

According to the present embodiment, the oscillation circuit receivespower from the power supply circuit, performs an oscillation operation,which oscillates a vibrator, and generates an oscillation signal. Thetemperature sensor circuit detects the temperature while performing theintermittent operation, and the logic circuit performs the temperaturecompensation processing based on the output of the temperature sensorcircuit. Further, in the present embodiment, the oscillation circuit isdisposed in the first circuit region, the temperature sensor circuit andthe logic circuit are disposed in the second circuit region, and thepower supply circuit is disposed in the third circuit region, which ispositioned between the first circuit region and the second circuitregion. In this way, the power supply circuit disposed in the thirdcircuit region is interposed between the first circuit region, in whichthe oscillation circuit is disposed, and the second circuit region, inwhich the temperature sensor circuit and the logic circuit are disposed.Therefore, the distance between the oscillation circuit, and thetemperature sensor circuit and logic circuit can be increased, the ACfluctuation in the current consumption due to the intermittent operationof the temperature sensor circuit becomes noise, and it is possible toeffectively reduce a situation in which an adverse effect is given tothe oscillation operation of the oscillation circuit, and the signalcharacteristics of the oscillation signal deteriorate.

Further, in the present embodiment, the temperature sensor circuit mayperform the intermittent operation of obtaining temperature datacorresponding to temperature during an operation period and stopping anoperation of the temperature sensor circuit after outputting thetemperature data to the logic circuit.

By performing the intermittent operation in which the temperature sensorcircuit repeats the operation period and the stop period in this way,the low power consumption of the circuit device can be achieved.

Further, in the present embodiment, the logic circuit may have a latchcircuit that latches the temperature data output by the temperaturesensor circuit during the operation period and perform the temperaturecompensation processing based on the latched temperature data evenduring a stop period of the temperature sensor circuit.

In this way, even when the temperature sensor circuit stops theoperation in the stop period after the operation period, the logiccircuit can properly execute the temperature compensation processingbased on the temperature data that is latched by the latch circuit.

Further, in the present embodiment, the temperature sensor circuit mayinclude a ring oscillator, a counter circuit that performs countprocessing for an output pulse signal of the ring oscillator by using aclock signal based on the oscillation signal and outputs temperaturedata based on a count value obtained by the count processing, and aregulator that supplies a regulated power supply voltage to the ringoscillator. Further, the regulator may supply the regulated power supplyvoltage to the ring oscillator during a period of the intermittentoperation.

According to such a configuration, the temperature sensor circuitcapable of performing a low voltage operation with low power consumptioncan be realized by using a small-scale circuit.

Further, in the present embodiment, the temperature sensor circuit mayinclude a current setting circuit that operates based on the regulatedpower supply voltage and sets an operation current of the ringoscillator.

By providing such a current setting circuit and setting the operationcurrent of the ring oscillator, it becomes possible to realize thefrequency control that changes the oscillation frequency of the ringoscillator according to the temperature.

Further, in the present embodiment, the circuit device may include anoutput buffer circuit outputting an output clock signal based on theoscillation signal, in which the output buffer circuit may be disposedin the second circuit region.

In this way, the power supply circuit is disposed in the third circuitregion between the first circuit region where the oscillation circuit isdisposed and the second circuit region where the output buffer circuitis disposed, the distance between the oscillation circuit and the outputbuffer circuit can be increased.

Further, in the present embodiment, the first circuit region may be acircuit region along a first side of the circuit device, and the secondcircuit region may be a circuit region along a second side, which is anopposite side of the first side of the circuit device.

In this way, the oscillation circuit is disposed on the first side ofthe circuit device, and the temperature sensor circuit and the logiccircuit are disposed on the second side, which is an opposite side ofthe first side of the circuit device, and the distance between theoscillation circuit, and the temperature sensor circuit and the logiccircuit can be increased.

Further, in the present embodiment, the circuit device may include apower supply terminal, to which a power supply voltage is input, and aground terminal, to which a ground voltage is input, in which the powersupply terminal and the temperature sensor circuit, or the groundterminal and the temperature sensor circuit may be disposed side by sidealong a side intersecting the first side and the second side.

In this way, the power supply voltage or the ground voltage can besupplied to the temperature sensor circuit with a short path route, andit becomes possible to reduce voltage fluctuations due to parasiticresistance or the like with the route from the power supply terminal orthe ground terminal to the temperature sensor circuit when the ACfluctuation of the current consumption occurs due to the intermittentoperation of the temperature sensor circuit.

Further, in the present embodiment, the circuit device may include aclock terminal outputting an output clock signal based on theoscillation signal, in which the temperature sensor circuit may bedisposed between the power supply terminal and the clock terminal.

In this way, the temperature sensor circuit and the clock terminal thatbecome noise sources can be collectively disposed along the sides thatintersect the first side and second side, and the transmission of noise,which is generated from the noise source, to the oscillation circuit canbe reduced.

Further, in the present embodiment, the oscillation circuit may bedisposed along the first side, and the temperature sensor circuit may bedisposed along the second side.

In this way, the temperature sensor circuit that becomes a noise sourceis disposed along the second side facing the first side, so that thetransmission of noise, which is generated from the noise source, to theoscillation circuit disposed along the first side, can be reduced.

Further, in the present embodiment, the circuit device may include aclock terminal outputting an output clock signal based on theoscillation signal, in which the clock terminal may be disposed at acorner portion in which a third side, which intersects the first sideand the second side, and the second side of the circuit deviceintersect.

In this way, the distance between the oscillation circuit, which isdisposed in the first circuit region, and the clock terminal can beincreased, and the transmission of noise of the output clock signal atthe clock terminal to the oscillation circuit can be reduced.

Further, in the present embodiment, the circuit device may include apower supply terminal, to which a power supply voltage is input, and aground terminal, to which a ground voltage is input, in which the powersupply terminal and the ground terminal may be diagonally disposed inthe second circuit region.

In this way, the noise, which is generated in the temperature sensorcircuit or the logic circuit in the second circuit region, is absorbedby the power supply terminal or the ground terminal side via the powersupply line or the ground line wired in the second circuit region, andthen the transmission of noise to the oscillation circuit can bereduced.

Further, in the present embodiment, the circuit device may include anoscillation circuit generating an oscillation signal by oscillating avibrator, a temperature sensor circuit performing an intermittentoperation, a logic circuit performing temperature compensationprocessing based on an output of the temperature sensor circuit, a powersupply terminal to which a power supply voltage is input, and a groundterminal to which a ground voltage is input. Further the oscillationcircuit may be disposed in a first circuit region, the temperaturesensor circuit and the logic circuit may be disposed in a second circuitregion, and the power supply terminal and the ground terminal may bediagonally disposed in the second circuit region.

According to the present embodiment, the oscillation circuit receivespower from the power supply circuit, performs an oscillation operation,which oscillates a vibrator, and generates an oscillation signal. Thetemperature sensor circuit detects the temperature while performing theintermittent operation, and the logic circuit performs the temperaturecompensation processing based on the output of the temperature sensorcircuit. Further, in the present embodiment, the oscillation circuit maybe disposed in a first circuit region, the temperature sensor circuitand the logic circuit may be disposed in a second circuit region, andthe power supply terminal and the ground terminal may be diagonallydisposed in the second circuit region. Therefore, the noise, which isgenerated in the temperature sensor circuit or the logic circuit in thesecond circuit region, is absorbed by the power supply terminal or theground terminal side via the power supply line or the ground line wiredin the second circuit region, and then the transmission of noise to theoscillation circuit can be reduced.

Further, in the present embodiment, the circuit device may include afirst power supply line that is coupled to the power supply terminal, iswired in the first circuit region, and supplies the power supply voltageto the oscillation circuit in the first circuit region, a first groundline that is coupled to the ground terminal, is wired in the firstcircuit region, and supplies the ground voltage to the oscillationcircuit in the first circuit region. Further, the circuit device mayinclude a second power supply line that is coupled to the power supplyterminal, is wired in the second circuit region by branching off fromthe power supply terminal separately from the first power supply line,and supplies the power supply voltage to the temperature sensor circuitand the logic circuit in the second circuit region. Further, the circuitdevice may include a second ground line that is coupled to the groundterminal, is wired in the second circuit region by branching off fromthe ground terminal separately from the first ground line, and suppliesthe ground voltage to the temperature sensor circuit and the logiccircuit in the second circuit region.

In this way, the noise generated in the temperature sensor circuit orthe logic circuit in the second circuit region is absorbed by the powersupply terminal side or the ground terminal side via the second powersupply line or the second ground line, and the noise is less likely tobe transmitted to the first power supply line or the first ground lineside. Therefore, it is possible to reduce the deterioration of thesignal characteristics of the oscillation signal due to the noise, whichis generated in the temperature sensor circuit or the logic circuit,being transmitted to the oscillation circuit.

Further, the present embodiment relates to an oscillator including thecircuit device described above and the vibrator.

Although the present embodiment has been described in detail asdescribed above, it will be easily understood by those skilled in theart that many modifications can be made without departing from the novelmatters and effects of the present disclosure. Accordingly, all suchmodification examples are intended to be included within the scope ofthe present disclosure. For example, a term described at least oncetogether with a different term having a broader meaning or the samemeaning in the specification or the drawings can be replaced with thedifferent term in any part of the specification or the drawings. Allcombinations of the present embodiment and the modification examples arealso included in the scope of the present disclosure. Further, theconfigurations/operations of the circuit device and oscillator are notlimited to those described in the present embodiment, and variousmodifications can be made.

What is claimed is:
 1. A circuit device comprising: an oscillationcircuit generating an oscillation signal by oscillating a vibrator; atemperature sensor circuit performing an intermittent operation; a logiccircuit performing temperature compensation processing based on anoutput of the temperature sensor circuit; and a power supply circuitsupplying power to the oscillation circuit, wherein the oscillationcircuit is disposed in a first circuit region, the temperature sensorcircuit and the logic circuit are disposed in a second circuit region,the power supply circuit is disposed in a third circuit regionpositioned between the first circuit region and the second circuitregion, and the logic circuit has a latch circuit that latches thetemperature data output by the temperature sensor circuit during theoperation period and performs the temperature compensation processingbased on the latched temperature data even during a stop period of thetemperature sensor circuit.
 2. The circuit device according to claim 1,wherein the temperature sensor circuit performs the intermittentoperation of obtaining temperature data corresponding to temperatureduring an operation period and stopping an operation of the temperaturesensor circuit after outputting the temperature data to the logiccircuit.
 3. The circuit device according to claim 1, further comprising:an output buffer circuit outputting an output clock signal based on theoscillation signal, wherein the output buffer circuit is disposed in thesecond circuit region.
 4. The circuit device according to claim 1,wherein the first circuit region is a circuit region along a first sideof the circuit device, and the second circuit region is a circuit regionalong a second side, which is an opposite side of the first side, of thecircuit device.
 5. The circuit device according to claim 4, furthercomprising: a power supply terminal to which a power supply voltage isinput; and a ground terminal to which a ground voltage is input, whereinthe power supply terminal or the ground terminal, and the temperaturesensor circuit are disposed side by side along a side intersecting thefirst side and the second side.
 6. The circuit device according to claim5, further comprising: a clock terminal outputting an output clocksignal based on the oscillation signal, wherein the temperature sensorcircuit is disposed between the power supply terminal and the clockterminal.
 7. The circuit device according to claim 4, wherein theoscillation circuit is disposed along the first side, and thetemperature sensor circuit is disposed along the second side.
 8. Thecircuit device according to claim 4, further comprising: a clockterminal outputting an output clock signal based on the oscillationsignal, wherein the clock terminal is disposed at a corner portion inwhich a third side, which intersects the first side and the second side,and the second side of the circuit device intersect.
 9. The circuitdevice according to claim 1, further comprising: a power supply terminalto which a power supply voltage is input; and a ground terminal to whicha ground voltage is input, wherein the power supply terminal and theground terminal are diagonally disposed in the second circuit region.10. An oscillator comprising: the circuit device according to claim 1;and the vibrator.
 11. A circuit device comprising: an oscillationcircuit generating an oscillation signal by oscillating a vibrator; atemperature sensor circuit performing an intermittent operation; a logiccircuit performing temperature compensation processing based on anoutput of the temperature sensor circuit; and a power supply circuitsupplying power to the oscillation circuit, wherein the oscillationcircuit is disposed in a first circuit region, the temperature sensorcircuit and the logic circuit are disposed in a second circuit region,the power supply circuit is disposed in a third circuit regionpositioned between the first circuit region and the second circuitregion, the temperature sensor circuit includes a ring oscillator, acounter circuit that performs count processing for an output pulsesignal of the ring oscillator by using a clock signal based on theoscillation signal and outputs temperature data based on a count valueobtained by the count processing, and a regulator that supplies aregulated power supply voltage to the ring oscillator, and the regulatorsupplies the regulated power supply voltage to the ring oscillatorduring a period of the intermittent operation.
 12. The circuit deviceaccording to claim 11, wherein the temperature sensor circuit includes acurrent setting circuit that operates based on the regulated powersupply voltage and sets an operation current of the ring oscillator. 13.A circuit device comprising: an oscillation circuit generating anoscillation signal by oscillating a vibrator; a temperature sensorcircuit performing an intermittent operation; a logic circuit performingtemperature compensation processing based on an output of thetemperature sensor circuit; a power supply terminal to which a powersupply voltage is input; and a ground terminal to which a ground voltageis input, wherein the oscillation circuit is disposed in a first circuitregion, the temperature sensor circuit and the logic circuit aredisposed in a second circuit region, and the power supply terminal andthe ground terminal are diagonally disposed in the second circuitregion, a first power supply line that is coupled to the power supplyterminal, is wired in the first circuit region, and supplies the powersupply voltage to the oscillation circuit in the first circuit region; afirst ground line that is coupled to the ground terminal, is wired inthe first circuit region, and supplies the ground voltage to theoscillation circuit in the first circuit region; a second power supplyline that is coupled to the power supply terminal, is wired in thesecond circuit region by branching off from the power supply terminalseparately from the first power supply line, and supplies the powersupply voltage to the temperature sensor circuit and the logic circuitin the second circuit region; and a second ground line that is coupledto the ground terminal, is wired in the second circuit region bybranching off from the ground terminal separately from the first groundline, and supplies the ground voltage to the temperature sensor circuitand the logic circuit in the second circuit region.